MwanzoDSCSY • OTCMKTS
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Disco ADR
Bei iliyotangulia
$ 33.05
Bei za siku
$ 29.73 - $ 31.79
Bei za mwaka
$ 16.10 - $ 37.00
Thamani ya kampuni katika soko
5.48T JPY
Wastani wa hisa zilizouzwa
elfu 105.60
Uwiano wa bei na mapato
-
Mgao wa faida
-
Habari za soko
Fedha
Taarifa ya Mapato
Mapato
Mapato halisi
| (JPY) | Sep 2025info | Mabadiliko Tangu Mwaka Uliopita |
|---|---|---|
Mapato | 104.62B | 8.71% |
Matumizi ya uendeshaji wa biashara | 28.60B | 8.08% |
Mapato halisi | 32.15B | 8.13% |
Kiwango cha faida halisi | 30.73 | -0.52% |
Mapato kwa kila hisa | — | — |
EBITDA | 47.64B | 4.92% |
Asilimia ya kodi ya mapato | 28.33% | — |
Taarifa ya Hali ya Kifedha
Jumla ya mali
Jumla ya dhima
| (JPY) | Sep 2025info | Mabadiliko Tangu Mwaka Uliopita |
|---|---|---|
Uwekezaji wa pesa taslimu na vipindi vifupi | 222.91B | -8.48% |
Jumla ya mali | 651.39B | 10.22% |
Jumla ya dhima | 133.69B | -13.45% |
Jumla ya hisa | 517.70B | — |
hisa zilizosalia | 108.43M | — |
Uwiano wa bei na thamani | 0.01 | — |
Faida inayotokana na mali | 17.36% | — |
Faida inayotokana mtaji | 22.02% | — |
Mtiririko wa pesa
Mabadiliko halisi ya pesa taslimu
| (JPY) | Sep 2025info | Mabadiliko Tangu Mwaka Uliopita |
|---|---|---|
Mapato halisi | 32.15B | 8.13% |
Pesa kutokana na shughuli | — | — |
Pesa kutokana na uwekezaji | — | — |
Pesa kutokana na ufadhili | — | — |
Mabadiliko halisi ya pesa taslimu | — | — |
Mtiririko huru wa pesa | — | — |
Kuhusu
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Afisa Mkuu Mtendaji (CEO)
Ilianzishwa
5 Mei 1937
Tovuti
Wafanyakazi
5,256
