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Disco Corp
Previous close
¥51,870.00
Day range
¥46,040.00 - ¥49,000.00
Year range
¥22,640.00 - ¥57,060.00
Market cap
5.16T JPY
Avg Volume
3.95M
P/E ratio
40.92
Dividend yield
0.88%
Primary exchange
TYO
Financials
Income Statement
Revenue
Net income
| (JPY) | Sep 2025info | Y/Y change |
|---|---|---|
Revenue | 104.62B | 8.71% |
Operating expense | 28.60B | 8.08% |
Net income | 32.15B | 8.13% |
Net profit margin | 30.73 | -0.52% |
Earnings per share | — | — |
EBITDA | 47.64B | 4.92% |
Effective tax rate | 28.33% | — |
Balance Sheet
Total assets
Total liabilities
| (JPY) | Sep 2025info | Y/Y change |
|---|---|---|
Cash and short-term investments | 222.91B | -8.48% |
Total assets | 651.39B | 10.22% |
Total liabilities | 133.69B | -13.45% |
Total equity | 517.70B | — |
Shares outstanding | 108.43M | — |
Price to book | 10.87 | — |
Return on assets | 17.36% | — |
Return on capital | 22.02% | — |
Cash Flow
Net change in cash
| (JPY) | Sep 2025info | Y/Y change |
|---|---|---|
Net income | 32.15B | 8.13% |
Cash from operations | — | — |
Cash from investing | — | — |
Cash from financing | — | — |
Net change in cash | — | — |
Free cash flow | — | — |
About
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.
The company is listed on the Tokyo Stock Exchange, where it is a component of the Nikkei 225 index. Wikipedia
Founded
May 5, 1937
Website
Employees
5,256
